High heat resistant thermosetting resins
Application:Thermosetting compound
Low CTE compound
Traditional compound | Prototype#1 | Prototype#2 | |
---|---|---|---|
Main resin (Epoxide) | Traditional resins | XR0014 | XR0020 |
Hardener | |||
Filler type | Spherical silica | Spherical silica | Spherical silica |
Filler content[wt%] | 85 | 85 | 85 |
property | |||
Spiral flow[cm] | 135 | 150 | 140 |
Gelation time[sec] | 40 | 45 | 40 |
Tg[℃] | 133 | 190 | 210 |
- Post cure condition:175℃3min → 175℃5h
The low CTE compound has higher Tg while having the same spiral flow and gel time as traditional compound.
The low CTE compound is used as an encapsulant that has both high heat resistance and low CTE.
High thermal conductivity compound
Traditional compound | Prototype#3 | |
---|---|---|
Filler content[%] | Alumina etc:85 | Alumina etc:≦90 |
Binder | Traditional resin | XR0014 |
Tg[℃] | <200 | 240 |
F.strength[MPa] | 120 | 100 |
F.modulus[MPa] | 30000 | 45000 |
Thermal conductivity[W/m・K] | 4.5 | 9.0 |
- Post cure condition: Traditional compound: 175℃3min → 175℃5h, Prototype#3: 175℃3min → 220℃5h
Low viscosity allows high filling of heat conductive fillers.
High thermal conductivity compound achieves 9W/ mk when it is highly filled with alumina etc.
Feel free to inquire